China PCB & PCBA

Specializing in PCBA solutions for about ten years, we acquire the latest technology and processes combined with state-of ¨Cthe-art quality management system in global scale. TOPSCOM leverages its level of expertise and knowledge to utilize the most advanced packaging technologies available, including:

-Surface Mount Technology (SMT)

- Automatic Insert Machine (AIM)  

-Chip Scale Package (CSP)

-Ball Grid Array (BGA)

-Fine Pitch Devices (flip chip)

-Miniature resistor and capacitor array

-Automated connector attach

-Direct and multiple chip attach

     To stress the feasibility of flexible manufacturing, We develop alternative manufacturing processes through our own capabilities and outsource some key processes to other reliable manufacturers in order to satisfy the customers¡¯ needs. These processes include:

- Chip on Board (COB)  

-Wavesolder

-Lead-free processing

-BGA Rework Station

-X-RAY

-ICT & FCT

-aqueous cleaning

    In addition to the state-of-the-art assembly technologies, TOPSCOM utilizes the most efficient processes available. We assign cross-functional teams to our client¡¯s project. By manifesting the strong sense of ownership and control, the outcomes are superior quality product and faster turnaround times. The utilization of flow processes in all production greatly reduces in-process time and thereby improves delivery time, while minimizing handling-related quality issues and assembly costs.